Catch up on the essentials
- The company framed the 600,000-square-foot structure as purpose-built to shorten the path from materials innovation to high-volume manufacturing for AI-era chips.
- The company characterized the EPIC Center as one of the most complex R&D construction projects in the world, housing nearly four acres of advanced cleanroom space.
- Applied Materials said chipmakers, systems companies, equipment suppliers and university researchers will work alongside its own scientists and engineers inside EPIC.
Selected from this article · 2026-10-13
Read on for the full pictureEPIC Center takes shape in Sunnyvale

Applied Materials said on Monday, October 12, 2026, that it unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, describing the facility as a $5 billion capital investment and the world's largest dedicated semiconductor equipment and process technology R&D site. The company framed the 600,000-square-foot structure as purpose-built to shorten the path from materials innovation to high-volume manufacturing for AI-era chips.
Scope and footprint of the facility
The company characterized the EPIC Center as one of the most complex R&D construction projects in the world, housing nearly four acres of advanced cleanroom space. According to figures cited in the unveiling, construction required more than six million hours, the foundation holds enough concrete to fill 34 Olympic-sized swimming pools, and the steel-reinforced structure contains enough steel to build two Eiffel Towers. Thirty-four roof trusses were said to span nearly 300 feet each, weighing as much as 12 school buses.
Founding partners and stated collaboration model
Applied Materials said chipmakers, systems companies, equipment suppliers and university researchers will work alongside its own scientists and engineers inside EPIC. Reported founding partners included TSMC, Intel, Samsung Electronics, Micron Technology and SK Hynix, alongside other industry and academic participants named by the company.
Industry statements on the AI roadmap
President and CEO Gary Dickerson said rising AI infrastructure demands are driving unprecedented complexity across the chipmaking roadmap, and that the industry must rethink how it collaborates to develop and commercialize next-generation semiconductor technologies. Intel CEO Lip-Bu Tan was cited as saying Intel sees a path to more than 1 trillion transistors in a package by 2030. The company said the center is intended to give chipmakers earlier access to new technologies and shorten development cycles.
Capital spending tied to customer projects
Applied Materials indicated that capital spending is expected to scale to approximately $5 billion as customer projects commence at the facility, framing the figure as a forward-looking investment level rather than a completed spend.
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