US chip manufacturing and packaging
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US chip manufacturing and packaging
Coverage of chipmakers’ manufacturing and packaging projects in the United States.
TSMC explores new Texas investment to expand U.S. chip output
TSMC is evaluating a potential Texas investment to grow its U.S. chipmaking capacity beyond the $265 billion already pledged in Arizona, according to people familiar with the talks.
Read original →SK Hynix in early talks with Intel on US memory-chip production at Ohio site
SK Hynix is in exploratory talks with Intel on a deal that could see the Korean memory maker produce chips on US soil for the first time, potentially at Intel's Ohio fab.
Read original →SK Hynix in talks with Intel on US memory chip production
SK Hynix is in talks with Intel to manufacture memory chips in the United States for the first time, exploring a potential lease of Intel's Ohio facility or a venture involving cloud firms.
Read original →SK hynix eyes Intel's Ohio fabs for first U.S. memory chip production
SK hynix is in talks with Intel on first U.S. memory chip production, with options including leasing space at Intel's delayed Ohio campus or forming a joint venture with AI cloud companies.
Read original →SK hynix breaks ground on $4 billion Indiana packaging plant, aiming for first U.S. HBM output by late 2029
SK hynix held an August 27, 2026 groundbreaking in West Lafayette, Indiana for a $4 billion advanced packaging facility, with first U.S. HBM mass production targeted for H2 2029.
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