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AI memory supply and competition

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AI memory supply and competition

Reporting on memory production, packaging investment and competition in AI hardware.

  1. Samsung narrows HBM gap with SK hynix in Q2 as share shifts reshape AI memory market

    Samsung lifted its Q2 HBM revenue share to 33% from 21%, cutting SK hynix's lead to 50% as Counterpoint expects HBM4 shipments to reshape rankings.

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  2. China's CXMT begins small-scale HBM3E production as it closes the gap with Korean memory leaders

    China's CXMT has begun small-scale HBM3E production for AI accelerators, drawing test orders from T-Head and Cambricon as it narrows the product gap with Samsung and SK hynix.

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  3. SK hynix breaks ground on $4 billion Indiana packaging plant, aiming for first U.S. HBM output by late 2029

    SK hynix held an August 27, 2026 groundbreaking in West Lafayette, Indiana for a $4 billion advanced packaging facility, with first U.S. HBM mass production targeted for H2 2029.

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